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Features
■ 0402 miniature size
■ Ceramic core provides stable electrical
Applications
■ RF modules
■ Cellular phones
■
■
■
■
characteristics
High Q
High self-resonant frequency
Flat top surface for automated assembly
RoHS compliant* and halogen free**
■ GPS receivers
■ Wireless PDAs, LANs
■ CATV ?lters, tuners
■ Cable modems, set-top boxes
CW100505 Series High Q Ceramic Chip Inductors
Electrical Speci?cations
General Speci?cations
Bourns Part No.
?
Inductance
L (nH)
Tol.
Q
Min.
Test Freq.
(MHz)
L/Q
SRF
(MHz)
Min.
DCR
(Ohms)
Irms
(mA)
Max.
Operating Temperature
................................-55 °C to +125 °C
(Temperature rise included)
Storage Temperature
CW100505-1N0D
CW100505-2N2D
CW100505-2N7D
CW100505-3N3J
CW100505-3N9J
CW100505-4N7J
CW100505-5N6J
CW100505-6N8J
CW100505-8N2J
CW100505-10NJ
CW100505-12NJ
1.0
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10.0
12.0
±0.3 nH
±0.3 nH
±0.3 nH
±5 %
±5 %
±5 %
±5 %
±5 %
±5 %
±5 %
±5 %
13
18
16
20
20
15
23
20
25
23
26
250
250
250
250
250
250
250
250
250
250
250
6000
6000
6000
6000
5800
4775
5800
4800
4400
3900
3600
0.045
0.070
0.120
0.066
0.066
0.130
0.083
0.083
0.104
0.195
0.120
1360
960
640
840
840
640
760
680
680
480
640
................................-55 °C to +125 °C
Resistance to Soldering Heat
.......................... +260 °C, 5 sec. max.
Temperature Rise .....15 °C at rated Irms
Materials
Core ...........................................Ceramic
Wire ............Enameled copper (Class H)
Terminal ...........................Mo/Mn+Ni+Au
Packaging .... 10,000 pcs. per 7-inch reel
Product Dimensions
CW100505-15NJ
CW100505-18NJ
CW100505-22NJ
CW100505-27NJ
CW100505-33NJ
CW100505-39NJ
CW100505-47NJ
CW100505-56NJ
CW100505-68NJ
CW100505-82NJ
CW100505-R10J
CW100505-R12J
15.0
18.0
22.0
27.0
33.0
39.0
47.0
56.0
68.0
82.0
100.0
120.0
±5 %
±5 %
±5 %
±5 %
±5 %
±5 %
±5 %
±5 %
±5 %
±5 %
±5 %
±5 %
26
25
25
26
24
25
26
22
22
20
20
20
250
250
250
250
250
250
200
200
200
150
150
150
3280
3100
2800
2480
2350
2100
2100
1760
1620
1500
1300
1100
0.172
0.230
0.300
0.298
0.350
0.550
0.830
0.970
1.120
1.250
2.520
2.660
560
420
400
400
400
320
210
200
180
150
120
110
0.30
(.012)
0.50 ± 0.1
(.020 ± .004)
1.00 ± 0.1
(.039 ± .004)
0.55 ± 0.1
(.022 ± .004)
Soldering Pro?le
Temperature
0.20
(.008)
0.20
(.008)
Rising
Area
-
Preheat
Area
-
Reflow
Area
20~
-
Forced Cooling
Area
0.50
(.020)
4 °C/
Sec.
150~200 °C / 60~120 Sec.
40 °C/
Sec.
-1~5 °C/Sec. Max.
Recommended Layout
Max.
Max.
250
-
PEAK TEMP.
260 °C
230 °C
50 SECONDS MAX.
0.50
(.020)
0.50
(.020)
200
150
100
50
-
70 SECONDS MAX.
0.40
(.016)
DIMENSIONS:
MM
(INCHES)
0.40
(.016)
Schematic
0
50
100
150
200
250
Time (Seconds)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
** Bourns follows the prevailing de?nition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less;
(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
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